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this is information on a product in full production. may 2013 docid15587 rev 10 1/19 19 STGIPS10K60A sllimm? (small low-loss intelligent molded module) ipm, 3-phase inverter - 10 a, 600 v short-circuit rugged igbt datasheet - production data features ? ipm 10 a, 600 v, 3-phase igbt inverter bridge including control ics for gate driving and free- wheeling diodes ? short-circuit rugged igbt ? v ce(sat) negative temperature coefficient ? 3.3 v, 5 v, 15 v cmos/ttl inputs comparators with hysteresis and pull down resistor ? under-voltage lockout ? internal bootstrap diode ? interlocking function ? dbc substrate leading to low thermal resistance ? isolation rating of 2500 vrms/min. ? 5 k ?? ntc thermistor for temperature control ? ul recognized : ul1557 file e81734 applications ? 3-phase inverters for motor drives ? home appliances, such as washing machines, refrigerators, air conditioners description this intelligent power module provides a compact, high performance ac motor drive in a simple, rugged design. combining st proprietary control ics with the most advanced short-circuit- rugged igbt system technology, this device is ideal for 3-phase inverters in applications such as home appliances and air conditioners. sllimm? is a trademark of stmicroelectronics. sdip-25l table 1. device summary order code marking package packaging STGIPS10K60A gips10k60a sdip-25l tube www.st.com
contents STGIPS10K60A 2/19 docid15587 rev 10 contents 1 internal block diagram and pi n configuration . . . . . . . . . . . . . . . . . . . . 3 2 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3.1 control part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.1 ntc thermistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
docid15587 rev 10 3/19 STGIPS10K60A internal block diagram and pin configuration 1 internal block diagram and pin configuration figure 1. internal block diagram l i n h i n h v g o u t l v g g n d l i n h i n h v g o u t l v g g n d l i n h i n v c c v boot b o o t h v g o u t l v g g n d l i n w o u t u v boot b o o t w v h i n w l i n u g n d n w l i n v v boot b o o t u h i n u v boot b o o t v o u t w h i n v p u o u t v w v c c t 1 n v n u t 2 n t c p p p in i n 1 6 p in i n 1 p i n 1 7 p in i n 2 5 v boot b o o t v c c v c c v boot b o o t am09364v1 a m 0 9 3 6 4 v 1
internal block diagram and pin configuration STGIPS10K60A 4/19 docid15587 rev 10 figure 2. pin layout (bottom view) table 2. pin description pin symbol description 1out u high side reference output for u phase 2v boot u bootstrap voltage for u phase 3lin u low side logic input for u phase 4hin u high side logic input for u phase 5v cc low voltage power supply 6out v high side reference output for v phase 7v boot v bootstrap voltage for v phase 8 gnd ground 9lin v low side logic input for v phase 10 hin v high side logic input for v phase 11 out w high side reference output for w phase 12 v boot w bootstrap voltage for w phase 13 lin w low side logic input for w phase 14 hin w high side logic input for w phase 15 t 1 ntc thermistor terminal 1 16 t 2 ntc thermistor terminal 2 17 n w negative dc input for w phase 18 w w phase output 19 p positive dc input 20 n v negative dc input for v phase 21 v v phase output 22 p positive dc input 23 n u negative dc input for u phase 24 u u phase output 25 p positive dc input
docid15587 rev 10 5/19 STGIPS10K60A electrical ratings 2 electrical ratings 2.1 absolute maximum ratings table 3. inverter part symbol parameter value unit v pn supply voltage applied between p - n u , n v , n w 450 v v pn(surge) supply voltage (surge) applied between p - n u , n v , n w 500 v v ces each igbt collector emitter voltage (v in (1) = 0) 1. applied between hin i , lin i and g nd for i = u, v, w. 600 v i c (2) 2. calculated according to the iterative formula: each igbt continuous collector current at t c = 25c 10 a i cp (3) 3. pulse width limited by max junction temperature. each igbt pulsed collector current 20 a p tot each igbt total dissipation at t c = 25c 33 w t scw short-circuit withstand time, v ce = 0.5 v (br)ces ? t j = 125 c, v cc = v boot = 15 v, v in (1) = 5 v 5s table 4. control part symbol parameter min. max unit v out output voltage applied between out u , out v , out w - gnd v boot -18 v boot + 0.3 v v cc low voltage power supply - 0.3 18 v v boot bootstrap voltage - 0.3 618 v v in logic input voltage applied between hin i , lin i and g nd for i = u, v, w - 0.3 v cc + 0.3 v dv out /dt allowed output slew rate 50 50 v/ns table 5. total system symbol parameter value unit v iso isolation withstand voltage applied between each pin and heatsink plate (ac voltage, t = 60 sec.) 2500 v t j power chips operating junction temperature -40 to 150 c t c module case operating temperature -40 to 125 c i c t c ?? t jmax ?? t c ? r thj c ? v ce sat ?? max ?? t jmax ?? i c t c ?? ? ?? ? ------------------------------------------------------------------------------------------------------- =
electrical ratings STGIPS10K60A 6/19 docid15587 rev 10 2.2 thermal data table 6. thermal data symbol parameter value unit r thjc thermal resistance junction-case single igbt max. 3.8 c/w thermal resistance junction-case single diode max. 5.5 c/w
docid15587 rev 10 7/19 STGIPS10K60A electrical characteristics 3 electrical characteristics t j = 25c unless otherwise specified. note: t on and t off include the propagation delay time of the internal drive. t c(on) and t c(off) are the switching time of igbt itself under t he internally given gate driving condition. table 7. inverter part symbol parameter test conditions value unit min. typ. max. v ce(sat) collector-emitter saturation voltage v cc = v boot = 15 v, v in (1) = 5 v, i c = 5 a 1. applied between hin i , lin i and g nd for i = u, v, w. -2.12.5 v v cc = v boot = 15 v, v in (1) = 5 v, i c = 5 a, t j = 125 c -1.8 i ces collector-cut off current (v in (1) = 0 ?logic state?) v ce = 550 v v cc = v boot = 15 v - 150 a v f diode forward voltage v in (1) = 0 ?logic state?, i c = 5 a -1.9v inductive load switching time and energy t on turn-on time v dd = 300 v, v cc = v boot = 15 v, v in (1) = 0 ? 5 v, i c = 5 a (see figure 4 ) - 320 - ns t c(on) crossover time (on) - 70 - t off turn-off time - 430 - t c(off) crossover time (off) - 135 - t rr reverse recovery time - 130 - e on turn-on switching losses - 65 - j e off turn-off switching losses - 75 -
electrical characteristics STGIPS10K60A 8/19 docid15587 rev 10 figure 3. switching time test circuit figure 4. switching time definition vboot>vcc l ic vce vcc input 0 1 bus lin hin vcc lvg hvg out boot gnd am17163v1 v ce i c i c v in t on t c(on) v in(on) 10% i c 90% i c 10% v ce (a) turn-on (b) turn-off t rr 100% i c 100% i c v in v ce t off t c(off) v in(off) 10% v ce 10% i c am09223v1
docid15587 rev 10 9/19 STGIPS10K60A electrical characteristics 3.1 control part table 8. low supply voltage (v cc = 15 v unless ot herwise specified) symbol parameter test conditions min. typ. max. unit v ccthon under voltage turn on threshold 9.1 9.6 10.1 v v ccthoff under voltage turn off threshold 7.9 8.3 8.8 v v cchys under voltage hystereses 0.9 v i qccu under voltage quiescent supply current v cc < 7.9 v 0.75 1.2 ma i qcc quiescent current v cc = 15 v 1 1.5 ma table 9. bootstrap supply (v cc = 15 v unless otherwise specified) symbol parameter test conditions min. typ. max. unit v boot_thon under voltage turn on threshold 8.5 9.5 10.5 v v boot_thoff under voltage turn off threshold 7.2 8.3 9.2 v v boothys under voltage hystereses 0.9 v i qboot quiescent current 250 a r ds(on) bootstrap driver on resistance v cc > 12.5 v 125 ? table 10. logic input (1) (v cc = 15 v unless otherwise specified) 1. see figure 9: dead time and interlocking definition . symbol parameter test conditions min. typ. max. unit v il low level logic input voltage 1.1 v v ih high level logic input voltage 1.8 v i il low level logic input current v in (2) = 0 2. applied between hin i , lin i and g nd for i = u, v, w -1 a i ih high level logic input current v in (1) = 15 v 20 70 a
electrical characteristics STGIPS10K60A 10/19 docid15587 rev 10 3.1.1 ntc thermistor equation 1: resistance variation vs. temperature where t are temperatures in kelvin. figure 5. ntc resistance vs. temperature figure 6. ntc resistance vs. temperature (zoom) table 11. ntc thermistor symbol parameter test cond itions min. typ. max. unit. r 25 resistance t = 25c 5 k ? r 125 resistance t = 125c 300 ? b b-constant t = 25c to 85c 3340 k t operating temperature -40 125 c rt ?? r 25 e b 1 t --- 1 298 --------- - ? ?? ?? ? = am17164v1 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 120 (c) ntc [k ] min. max. center am17165v1 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 50 60 70 80 90 100 110 120 (c) ntc [k ] max. min. center
docid15587 rev 10 11/19 STGIPS10K60A electrical characteristics minimum recommended dead time (dt) between low and high side logic input: 1 s. figure 7. maximum i c(rms) current vs. switching frequency (1) figure 8. maximum i c(rms) current vs. f sine (1) 1. simulated curves refer to typical igbt parameters and maximum r thj-c . v pn = 300 v, modulation index = 0.8, pf = 0.6, t j = 150 c, f sine = 60 hz t c = 100 c t c = 80 c i c (rms) 6 6 f sw (khz) (a) 410 8 10 12 12 81416 am03801v1 fsw = 12 khz fsw = 20 khz fsw = 16 khz v pn = 300 v, modulation index = 0.8, pf = 0.6, t j = 150 c, t c = 100 c i c (rms) 5 4 f sine (hz) (a) 1 10 6 7 8 am03802v1 figure 9. dead time a nd interlocking definition dt dt dt lin hin lvg hvg interlocking function am03794v1
application information STGIPS10K60A 12/19 docid15587 rev 10 4 application information figure 10. typical application circuit am01231v1 l i n h i n h v g o u t l v g g n d l i n h i n h v g o u t l v g g n d l i n h i n v c c v boot b o o t h v g o u t l v g g n d m n t c 1 2 v-phase current w-phase current u-phase current out u v boot u vdc lin u hin u v cc gnd +15v line lin w hin w t 1 t 2 + controller p u n u v n v w n w v boot b o o t v boot b o o t out v v boot v v c c v c c lin v hin v out w v boot w c1 c 1 c2 c 2 c3 c 3 r1 r 1 t1 t 1 d1 d 1 r2 r 2 t2 t 2 d2 d 2 r3 r 3 t3 t 3 d3 d 3 r4 r 4 t4 t 4 d4 d 4 r5 r 5 t5 t 5 d5 d 5 r6 r 6 t6 t 6 d6 d 6
docid15587 rev 10 13/19 STGIPS10K60A application information 4.1 recommendations ? input signal hin,lin are ac tive-high logic. a 500 k ? (typ.) pull down resistor is built-in for each high side in put. if an external rc filter is used, for noise immunity, pay attention to the variation of the input signal level. ? to prevent the input signals oscillation, t he wiring of each input should be as short as possible. ? by integrating an application specific type hv ic inside the module , direct coupling to mcu terminals without any opto-coupler is possible. ? each capacitor should be located as nearby the pins of ipm as possible. ? low inductance shunt resistors should be used for phase leg current sensing. ? electrolytic bus capacitors should be mounte d as close to the module bus terminals as possible. additional high frequency ceramic capacitor mounted close to the module pins will further im prove performance. for further details refer to an3338. table 12. recommended operating conditions symbol parameter conditions min. typ. max. unit v pn supply voltage applied between p-nu, nv, nw 300 400 v v cc control supply voltage applied between v cc -gnd 12 15 17 v v bs high side bias voltage applied between v booti -out i for i = u, v, w 11.5 17 v t dead blanking time to prevent arm-short for each input signal 1 s f pwm pwm input signal -40c < t c < 100c -40c < t j < 125c 20 khz t c case operation temperature 100 c
package mechanical data STGIPS10K60A 14/19 docid15587 rev 10 5 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and prod uct status are available at: www.st.com. ecopack is an st trademark. please refer to dedicated technical note tn0107 for mounting instructions. table 13. sdip-25l mechanical data dim. mm. min. typ. max. a 43.90 44.40 44.90 a1 1.15 1.35 1.55 a2 1.40 1.60 1.80 a3 38.90 39.40 39.90 b 21.50 22.00 22.50 b1 11.25 11.85 12.45 b2 24.83 25.23 25.63 c 5.00 5.40 6.00 c1 6.50 7.00 7.50 c2 11.20 11.70 12.20 e 2.15 2.35 2.55 e1 3.40 3.60 3.80 e2 4.50 4.70 4.90 e3 6.30 6.50 6.70 d 33.30 d1 5.55 e 11.20 e1 1.40 f 0.85 1.00 1.15 f1 0.35 0.50 0.65 r 1.55 1.75 1.95 t 0.45 0.55 0.65 v0 6
docid15587 rev 10 15/19 STGIPS10K60A package mechanical data figure 11. sdip-25l drawing dimensions data 8154676_h
package mechanical data STGIPS10K60A 16/19 docid15587 rev 10 figure 12. packaging specifications of sdip-25l package am10488v1 base quantity: 11 pcs bulk quantity: 132 pcs 8123127_e
docid15587 rev 10 17/19 STGIPS10K60A package mechanical data figure 13. sdip-25l shipping tube type b (dimensions are in mm.) antis tatic s 03 pvc am10487v1 8123127_e base quantity: 11 pcs bulk quantity: 132 pcs
revision history STGIPS10K60A 18/19 docid15587 rev 10 6 revision history table 14. document revision history date revision changes 16-apr-2009 1 initial release. 11-may-2009 2 added figure 7 and figure 8 . 17-jul-2009 3 reduced v ce(sat) value on table 7 . 06-apr-2010 4 document promoted from pr eliminary data to datasheet. inserted figure 3: switching time test circuit and table 12: recommended operating conditions . updated table 5: total system , table 6: thermal data , table 7: inverter part , figure 5: ntc resistance vs. temperature , figure 7: maximum ic(rms) current vs. switching frequency , figure 8: maximum ic(rms) current vs. fsine (1) and section 5: package mechanical data . 15-jun-2010 5 updated table 7: inverter part . minor text changes to improve readability. 17-nov-2010 6 updated ta ble 3 , 5 , 11 and 12 . modified figure 7 and figure 8 . 07-mar-2011 7 updated title with sllimm? in cover page, added sdip-25l tube dimensions figure 12 on page 16 . 04-nov-2011 8 updated title with sllimm? (small low-loss intelligent molded module) ipm, 3-phase inverter - 10 a, 600 v short-circuit rugged igbt in cover page and sdip-25l mechanical data table 13 on page 14 , figure 11 on page 15 . 28-aug-2012 9 modified: min. and max. value table 4 on page 5 . updated: table 13 on page 14 , figure 11 on page 15 and figure 12 on page 16 . added: figure 13 on page 17 . 02-may-2013 10 modified: figure 3 on page 8 and figure 5 on page 10 . added: figure 6 on page 10 .
docid15587 rev 10 19/19 STGIPS10K60A please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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